SR200-X3

Intel® QM175 MIL-STD Fanless Rugged System with Intel® Core™ i7-7820EQ Kaby Lake Processor, NVIDIA®1050Ti CUDA 768 GDDR5-4GB/Quadro® P3000 CUDA1280 GDDR5-6GB/Quadro® RTX3000 CUDA 1920 GDDR6-6GB GPU, 4 Independent DisplayPort, 9V to 36V DC-in, Extended Tem

Petr Chalupa

Petr Chalupa

Odolné PC, Military, TEMPEST, Doprava +420 251 614 073

Základní informace

  • MIL-STD 810G Compliance
  • 7th Generation Intel® Core™ i7-7820EQ Kaby Lake Processor
  • Up to 32GB DDR4 RAM
  • Onboard uSSD SATAIII up to 64 GB
  • NVIDIA®1050Ti CUDA 768 GDDR5-4GB/Quadro® P3000 CUDA1280 GDDR5-6GB/Quadro® RTX3000 CUDA 1920 GDDR6-6GB GPU Independent Displays by 2 x DP
  • 2 x mPCIe expansion slot (One Co-Layout with mSATA)
  • 2 x Intel® Gigabit Ethernet
  • 4 x USB 3.0, 1 x COM port
  • 9V to 36V DC-Input
  • Extended Temperature -40°C to 60°C

SR200-X3, EBX rugged system is a powerful system that is driven by Intel® 7th generation Kabylake CPU and chipset soldering onboard, integrated with Nvidia GPU 1050Ti CUDA 768 GDDR5-4GB/GTX 1650 CUDA896 GDDR5-4GB/GTX 1660S CUDA1408 GDDR6-6GB GPU that supports 2 independent DisplayPort. Processor i7-7820EQ plus Intel® QM175 chipset supports clock speed 2.8GHz, up to 3.5GHz. Quad cores, turbo up to 8 cores to cope with enormous data computing. Apart from computing power, the system is able to survive in harsh environment from -40 to 60°C, and ruggedness for vibration and shock is proven to pass MIL-810G standard. With the combination of high CPU computing power and rich display inputs, SR200-X3 is a perfect portable solution for rugged consoles & workstations, transportation, defense control room to share instant and accurate information on huge screen for in-time solutions.

Specifikace

 

CPU Intel® Core™ i7-7820EQ Processor (8M Cache, up to 3.70 GHz), 45W
GPU

NVIDIA®1050Ti CUDA 768 GDDR5-4GB

Quadro®P3000 CUDA 1280 GDDR5-6GB

Quadro®RTX3000 CUDA 1920 GDDR6-6GB 

CHIPSET Intel® QM175
MEMORY TYPE up to 32 GB DDR4 RAM
NAND Flash 64 GB SATA SSD onboard
EXPANSION SLOT 1 x Full-size mPCIe ( w / SIM card and mSATA supported )
1 x Half-size mPCIe
STORAGE DEVICE mSATA up to 512GB
ETHERNET CHIPSET 2 x RJ45 : Intel® I210IT & i219LM GbE LAN
FRONT I/O:  
USB 2 x USB 3.0 type A
POWER INPUT 1 x 4-pin terminal connector
DISPLAYPORT 2 x 20-pin DP connector (female)
REAR I/O:  
ETHERNET 2 x RJ45 ports GbE LAN
DVI-I 1 x 29-pin DVI-I connector ( Female )
DISPLAYPORT 2 x 20-pin DP connector (female)
AUDIO 2 x 3.5mm Audio JACK (Mic-in, Line-out)
COM 1x RS-232/422/485 ports, Jumper-selectable (DB9 male)
USB 2 x USB 3.0 type A
WINDOWS Windows 10 x32/x64
LINUX Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04
POWER REQUIREMENT 9V to 36V DC-in
DIMENSION 308 x 149 x 76mm
WEIGHT 4.3 kg 
OPERATING TEMP. -40 to 60°C(ambient with air flow)
STORAGE TEMP. -40 to 85°C
RELATIVE HUMIDITY 5% to 95%, non-condensing
MIL-STD-810G TEST Method 507.5, Procedure II (Temperature & Humidity)
Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6 Shock-Procedure I Operating (Mechanical Shock)
Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration)
Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration)
Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
EMC CE and FCC certificated
GREEN PRODUCT RoHS, WEEE compliance

Fotogalerie

Ke stažení

NAVRHNEME VÁM ŘEŠENÍ NA KLÍČ

Hledáte technologického partnera? Neváhejte se na nás obrátit.

šipka nahoru