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Základní informace
- ntel® Core™ 9th Gen. desktop, i7-9700TE, up to 4.3 GHz, 8 Core
- 4 x Independent 10/100/1000 Mbps PoE 802.3af/at, total 60W
- 2 x External SSD/HDD and 2 x mSATA for RAID 0, 1
- IP65 rating for waterproof
- 3 x WWAN module slot, each for 2 x external SIM socket
- 3 x mini-PCIe slot and 2 x M.2 key B slot
- CE/FCC/EN50155 class OT4 conformity
- Wide voltage input 24~110 VDC with isolation
NEXCOM mobile system nROK 7251 accomplishes operational efficiency of public transportation and service. Based on the 9th generation Intel® Core™ processors i7-9700TE and waterproof IP65 rating, it provides an integral solution incorporating high computing power, 4 port of independent PoE, wireless communication (3 x WWAN + 6 x SIM) and GNSS tracking support to record in-train activities, locations, high quality videos, driving patterns, and diagnostics for trains achieving better measures for safety and management.
Specifikace
CPU | Support 9th/8th generation Intel® Core™ i7/i5/i3 LGA1151 socket - Intel® Core™ i7-9700TE, TDP 35W |
Chipset | Intel® Q370 platform controller hub |
Memory | 2-Channel 260-pin DDR4 SO-DMIM sockets up to 32GB/channel (64GB for two channels, non-ECC up to 2666 MHz), default 4GB + 4GB industrial grade memory |
Video Output |
Chipset Intel® UHD graphics 630 |
Storage | 2 x 2.5” SATA 3.0 external SSD/HDD (compatible with 15mm height), RAID 0/1 supported 2 x mSATA 3.0 (BIOS selection, occupied mPCIe slot) |
Expansion | 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0 (BIOS selection)) 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA 3.0 (BIOS selection)), BOM optional full size mini-PCIe socket (USB 2.0) for LTE module with 2 x external SIM 1 x Full size mini-PCIe socket (USB 2.0) for LTE module, BOM optional M.2 3042 Key B socket (USB 2.0, USB 3.1 Gen2) for LTE/5G NR module with 2 x external SIM 1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen2) for LTE/5G NR module with 2 x external SIM 1 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen2, PCIe 3.0 (BOM optional)) for LTE/5G NR modem with 2 x external SIM |
GNSS and Onboard Sensor | 1 x Default U-blox NEO-M8N GNSS module for GPS/Gloness/QZSS/ Galileo/Beidou Optional modules with dead reckoning available G Sensor (3-axis, 10-bit resolution) |
LAN and Power over Ethernet | 4 x Independent LAN, 10/100/1000 Mbps I210-IT GbE, PoE 802.3af/at, max. 60W 1 x LAN, 10/100/1000 Mbps I219 support iAMT and WOL |
Security | TPM 2.0: Infineon SLB9665TT2.0FW5.62 (BOM optional) |
I/O Interface-Front | 21 x LED indicators (including 4 x programmable LED) 6 x Externally accessible SIM card sockets (4 x WWAN + 8 x SIM, BOM optional) w/ cover 1 x Reset button 2 x 2.5” external SSD/HDD 12 x SMA antenna hole 3 x USB 3.1 Gen1 type A (5V/1A) w/ cover 1 x USB 3.1 Gen2 type A (5V/1A) w/ cover |
I/O Interface-Rear | 4 x M12 X-coded PoE 802.3af/at, max. 60W 1 x M12 X-coded LAN port, 10/100/1000 Mbps 1 x Waterproof DC input connector with ignition, male type 1 x M8 for 1 x Mic-in, 1 x Line-out 2 x Waterproof DB9 (COM1/COM2) for full RS232 (isolation) 1 x Waterproof DB9 (COM3) for full RS232/422/485 (isolation) 1 x M12 A-coded 10pin (DIO) - 4 x DI and 4 x DO (isolation) - Power in for DIO isolation, 9~36VDC 1 x M12 A-coded for 2 x USB 2.0 1 x VGA |
Power Management & Software Support | Power input 24~110 VDC w/ isolation Reverse protection, OCP & UVP Selectable boot-up & shut-down voltage for low power protection by software Setting 8-level power on/off delay time by software 10~255 seconds WDT support, setup by software SDK (Windows/Linux) including utility and sample code |
Operating System | Windows 10 Linux |
Dimensions | 260 x 256 x 110 (W x D x H) (mm) |
Weight | 6.5kg |
Environment | Operating temperatures - EN 50155, class OT4 (-40~70°C), 85°C for 10 minutes (w/ 35W TDP CPU, industrial SSD) with air flow Storage temperatures: -40°C~80°C Relative humidity: 90% (non-condensing) Vibration (random) - 2g@5~500 Hz (in operation, SSD) Vibration (SSD) - Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure - Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity testShock (SSD) - Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g - Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g |
Certifications | CE FCC Class A EN 50155: 2017 - Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes - Interruptions of voltage supply class S1, S2 (S2: 36~110VDC@70% load) - Supply change over class C1, C2 - EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019 - Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30 - Shock and vibration IEC 61373 Class B - Protective coating class PC1 (PC2, by request) EN 45545-2: 2013+A1:2015 |
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