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CC10C - Rugged COM Express with ARM i.MX 6

VITA 59 RCE Module MEN CC10C je VITA 59 Rugged COM Express modul typ 6 používající NXP (dříve Freescale) ARM i.MX 6 CPU s architekturou jádra Cortex-A9 a integrovaným FPGA na desce pro flexibilní a utilizované I/O. The CC10C is a VITA 59 Rugged COM

Petr Chalupa

Odolné PC, Military, TEMPEST, Doprava +420 251 614 073 pchalupa@nowatron.cz

Poptat řešení

Základní informace Blokové schéma Specifikace Fotogalerie Ke stažení

Základní informace

NXP ARM i.MX 6 Series
Quad-core processor
Comprehensive usage of i.MX 6 I/O
Configurable FPGA I/O with 140 pins
Maximum flexibility in interface configuration
Up to 4 GB DDR3 SDRAM
eMMC multimedia card
U-Boot Universal Boot Loader
-40°C to +85°C Tcase qualified
Conduction cooling
VITA 59 in process, compliant with COM Express Compact, type 6
PICMG COM.0 COM Express version also available

Blokové schéma

Specifikace

CPU

NXP ARM i.MX 6 Series (ARM Cortex-A9 architecture)
The following CPU types are available:
- i.MX6S (i.MX 6Solo family)
- i.MX6DL (i.MX 6DualLite family)
- i.MX6D (i.MX 6Dual family)
- i.MX6Q (i.MX 6Quad family)

Memory

System Memory
- Soldered DDR3
- 1 GB, 2 GB, or 4 GB
Boot Flash
- 4 MB, 8 MB, or 16 MB

Mass Storage

The following mass storage devices can be assembled:

eMMC device, soldered; different sizes available

Graphics

Integrated in i.MX 6 processor
Multi-stream-capable HD video engine delivering up to 1080p60 decode, 1080p30 encode and 3D video playback in HD
Maximum resolution: 1920 x 1200 pixels (WUXGA)
Superior 3D graphics performance with up to four shaders performing 200 Mt/s and OpenCL support
Separate 2D and/or OpenVG Vertex acceleration engines for optimal user interface experience
Stereoscopic image sensor support for 3D imaging

Onboard Interfaces

Available via COM Express connectors
Video
- One HDMI/DVI interface
- One LVDS interface, dual-channel
- One MIPI CSI-2 camera serial host interface; optional
Audio
- One AC'97 audio interface
- One I2S audio interface
SATA
- One channel, SATA Revision 2.x (3 Gbit/s); only with i.MX6D or i.MX6Q
SDIO/SDHC
- One channel for MMC/SD/SDIO cards
USB
- Two host channels, USB 2.0 (480 Mbit/s), or
- Six host channels, USB 2.0 (480 Mbit/s)
- One channel always implemented as OTG (On-The-Go) host/client channel
Ethernet
- One channel, 1000BASE-T (1 Gbit/s)
- One channel, 100BASE-T (100 Mbit/s); optional
- Two link and activity LED signals per channel
PCI Express
- One x1 link (250 MB/s per link), PCIe 1.1 (2.5 Gbit/s per lane)
ExpressCard
- One interface
CAN bus
- Two CAN bus channels, 2.0B CAN protocol, 1 Mbit/s
- Two additional CAN bus channels, 2.0A/B CAN protocol, 1 Mbit/s; with FPGA; optional
- External transceivers to be implemented on carrier board
UART
- Up to six interfaces, up to 4 Mbit/s
- Physical interfaces RS232 or RS422/RS485 depending on interface controller and implementation on carrier board
PWM
- Three PWM interfaces
I2C
- Up to four I2C interfaces
SPI
- Up to three SPI interfaces
COM Express control signals
- Four COM Express control signals
GPIO
- 9 GPIO lines, 4 GPO lines, 3 GPI lines
- 64 GPIO lines, with FPGA; optional

FPGA

No FPGA assembled, with custom configuration of i.MX 6 I/O interfaces, or
FPGA Altera Cyclone IV, with custom IP core and i.MX 6 I/O configuration
- Total available pin count: 140 pins on COM Express connectors

Supervision and Control

Power supervision and watchdog
Temperature measurement
- i.MX 6 temperature measurement
- Additional onboard temperature sensor; optional
Real-time clock, with supercapacitor or battery backup on the carrier board

Computer-On-Module Standard

CC10C: VITA 59 RCE: Rugged COM Express in process
- With conduction cooling cover and frame
- Rugged COM Express Compact, Module Pin-out Type 6
CC10: PICMG COM.0 COM Express Module Base Specification
- COM Express Compact, Module Pin-out Type 6

Electrical Specifications

Supply voltage
- +12 V (9 to 16 V)
Power consumption
- 12 W, measured in stress test using 15CC10C00, i.MX6Q quad-core @ 1.0 GHz
- 7.4 W, measured in test (activity on Gb Ethernet and 1 USB interface) using 15CC10C00, i.MX6Q quad-core @ 1.0 GHz
- 5 W, measured in test (activity on Gb Ethernet and 1 USB interface) using 15CC10-00, i.MX6S single-core @ 800 MHz

Mechanical Specifications

Dimensions
- 105 mm x 105 mm x 18 mm (models conforming to VITA 59 RCE Compact format, PCB mounted between a cover and a frame)
- 95 mm x 95 mm (models conforming to PICMG COM.0 COM Express Compact format)
Weight
- 356 g (model 15CC10C00)
- 40 g (model 15CC10-00)

Environmental Specifications

Temperature range (operation)
- -40°C to +85°C Tcase (VITA 59 cover/frame) (qualified components) (model 15CC10C00)
- -40°C to +85°C (qualified components) (model 15CC10-00)
Temperature range (storage): -40°C to +85°C
Cooling concept
- Conduction-cooled (models conforming to VITA 59 RCE Compact format, PCB mounted between a cover and a frame)
- Air-cooled (models conforming to PICMG COM.0 COM Express Compact format)
Relative humidity (operation): max. 95% non-condensing
Relative humidity (storage): max. 95% non-condensing
Altitude: -300 m to +3000 m
Shock: 50 m/s², 30 ms (EN 61373)
Vibration (function): 1 m/s², 5 Hz to 150 Hz (EN 61373)
Vibration (lifetime): 7.9 m/s², 5 Hz to 150 Hz (EN 61373)
Conformal coating; optional

Reliability

MTBF

652 986 h @ 40°C according to IEC/TR 62380 (RDF 2000) (model 15CC10C00)
1 233 470 h @ 40°C according to IEC/TR 62380 (RDF 2000) (model 15CC10-00)

Safety

Flammability

UL 94V-0

EMC

EMC behavior generally depends on the system and housing surrounding the COM module.
The Rugged COM Express module in its cover and frame supports the system to meet the requirements of
- EN 55022 (radio disturbance)
- IEC 61000-4-2 (ESD)
- IEC 61000-4-3 (electromagnetic field immunity)
- IEC 61000-4-4 (burst)
- IEC 61000-4-5 (surge)
- IEC 61000-4-6 (conducted disturbances)

Software Support

Linux
VxWorks

Fotogalerie

Ke stažení

Datasheet MEN CC10C

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